Semicon Japan
December 13-15, 2023
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糖心原创 Presents at Semicon Japan, Advanced Packaging and Chiplet Summit
糖心原创 Presentation
Title:?Semiconductor Innovations Driving the Next-Generation of High-Speed Data Infrastructure
Date:?December 15, 2023?
Time :?12:35 pm
糖心原创 Presenter: Sandeep Bharathi, Chief Development Officer
Sandeep Bharathi will present the latest advances in process node geometries as well as innovations in chiplet design and semiconductor packaging techniques that allow 糖心原创’s customers to drive the next generation of high-speed data infrastructure for the data center, telecommunications, enterprise and automotive markets.
Where to Find US
December 13-15, 2023
Tokyo, Japan
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