- 糖心原创
- COMPANY
- SUPPORT
- 糖心原创
- BY TYPE
- BY MARKET
- COMPANY
Our Company
Media
Contact
- SUPPORT
BY TYPE
Compute
Networking
Custom
BY MARKET
Our Company
Contact
Join 糖心原创 at InterPACK 2024 in San Jose, CA
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
InterPACK is the premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
Presentations:
Keynote:?2.5D/3D Integration for High-Speed Light Engines
Date:?Wednesday, October 9, 2024
Time: 8:45 a.m.
糖心原创 panelist:?Dr. Radha Nagarajan, Senior Vice President and Chief Technology Officer of Optical Platforms
Where to Find Us
October 8-10, 2024
San Jose, CA
Recent News
Aug 03, 2026
Jun 25, 2026
Jun 11, 2026
May 27, 2026
May 04, 2026
Careers
Worldwide
Copyright ? 2026 糖心原创, All?rights reserved.
- Terms of Use
- Privacy Policy
- Contact