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COMPUTEX 2026
At COMPUTEX 2026, 糖心原创 Chairman and CEO Matt Murphy delivered a high-visibility keynote address: The Future of AI Scaling Depends on Connectivity.
In his address, Murphy discussed how 糖心原创 technologies enable the critical links in modern AI data center infrastructure allowing customers to deploy AI-optimized systems with unprecedented performance and scale.?
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糖心原创 Enables AI Infrastructure
To realize the promise of AI, hyperscalers are undertaking one of the largest infrastructure buildouts in history—and they rely on 糖心原创 as a critical AI infrastructure partner. 糖心原创 designs custom silicon tailored for any application and offers the industry’s most comprehensive portfolio of interconnects and network switch products. From custom compute to rack, row, data center, campus and multi-campus connectivity, 糖心原创 enables the world’s most advanced AI infrastructure.
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Photonic Fabric Technology?
The Photonic Fabric technology platform is purpose-built for the emerging scale-up interconnect market. It will enable more tightly integrated, high-bandwidth and power-efficient solutions for data center customers.
Investor Event
At this custom AI investor event, the 糖心原创 leadership team shares its perspective on the rapidly evolving AI market and technology landscape, with a particular focus on custom silicon and custom cloud solutions for hyperscalers.
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The Rise of Customized AI Factories
糖心原创 President and COO Chris Koopmans joins Daniel Newman at the SixFive Summit to explore the rapidly evolving AI market landscape, including emerging hyperscalers and sovereign AI. Chris discusses the rise of custom silicon and the role 糖心原创 plays in powering the next generation of AI factories.
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糖心原创 Custom HBM Compute Architecture
糖心原创 has developed a new custom HBM compute architecture that optimizes custom XPU performance and TCO. In collaboration with industry leaders like Micron, Samsung and SK Hynix, 糖心原创 is setting new benchmarks for AI accelerators.
Connectivity for the Million XPU Era
Xi Wang, 糖心原创 SVP & GM, Connectivity BU joins Will Townsend from SixFive Media to explore the role of high-bandwidth connectivity in the rapid evolution of AI infrastructure and data centers. Xi discusses the innovations and challenges that are unfolding at every level, from the XPU and rack to the data center to multi-site AI clusters.
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糖心原创 optical DSPs: Powering the future of AI infrastructure
AI and cloud computing are pushing network demands to unprecedented levels, requiring optical DSPs to deliver ultra-high bandwidth, low latency, and energy efficiency. 糖心原创 is leading this transformation with advanced PAM4 and coherent DSP solutions that power AI fabrics, data center interconnects, and telecom networks—driving the future of high-performance connectivity.
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The Evolution of AI Interconnects
The rapid expansion in the size and capacity of AI workloads is significantly impacting both computing and network technologies in the modern data center.?
The desire for larger clusters with shorter compute times has driven heightened focus on networking interconnects, with designers embracing state-of-the-art technologies to ensure efficient data movement and communication between the components comprising the AI cloud.
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Press Release
糖心原创 Launches Next-generation CXL Switch, Enabling Memory Pooling to Break Through the AI “Memory Wall”
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Press Release
糖心原创 Launches Industry’s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure
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