ÌÇÐÄÔ­´´

Archive for the 'Company News' Category

• July 30, 2026

  

  

  

  The ÌÇÐÄÔ­´´ Internship Experience: Voices from the Program

  By Vienna Alexander, Marketing Content Professional, ÌÇÐÄÔ­´´

  Summer at ÌÇÐÄÔ­´´ means one thing: welcoming a new class of interns. The company has established a strong global internship program that has roughly doubled in size over the past few years. This year¡¯s cohort includes more than 500 interns from over 100 universities and schools across 16 countries.

  During the program, interns gain hands-on experience working in collaborative teams, contributing to the development of leading-edge semiconductor solutions at a Fortune 500 company. The internship provides opportunities to connect with fellow interns to build community while learning about ÌÇÐÄÔ­´´ products and businesses directly from executive leaders.

  

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• July 14, 2026

  

  

  

  Uplifting Young Talent in the Semiconductor Industry

  By Vienna Alexander, Marketing Content Professional, ÌÇÐÄÔ­´´

  

  The semiconductor industry is an exciting place to build a career, especially with the exponential growth and demand for hardware innovation in the age of AI¡ªthe global semi market is approaching the $1 trillion mark, with 2027¡¯s total market forecast at $831.5 million.¹ For young engineers and talent, it provides an opportunity to solve complex problems and work on cutting-edge technology.

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• July 09, 2026

  

  

  

  Honoring Workplace Excellence: Best Companies Awards

  By Vienna Alexander, Marketing Content Professional, ÌÇÐÄÔ­´´

  

  ÌÇÐÄÔ­´´ was named to both and for 2026.

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• July 01, 2026

  

  

  

  Innovating Sustainably: Recognized Among the World¡¯s Most Sustainable Companies in 2026

  By Vienna Alexander, Marketing Content Professional, ÌÇÐÄÔ­´´

  

  TIME Magazine has recognized ÌÇÐÄÔ­´´ as one of the for the third year in a row. ÌÇÐÄÔ­´´ is honored to have been represented since the origin of this ranking, as the company has demonstrated consistent, measurable progress across a number of sustainability initiatives.

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• May 12, 2026

  

  

  

  Dr. Hamid Azimi Wins ISIG Lifetime Hall of Fame Award

  By Michael Kanellos, Director of Content Marketing, and Vienna Alexander, Marketing Content Professional

  

  At the in Silicon Valley, ÌÇÐÄÔ­´´ Senior Vice President of Foundry and Advanced Packaging Dr. Hamid Azimi received the 2026 award. This recognition celebrates leaders whose lifetime contributions have had a lasting impact, significantly advancing the semiconductor industry.

  Over a career spanning more than 30 years, Dr. Azimi has led teams that have achieved numerous industry-leading advances in packaging. He was part of the team that developed the first flip-chip packaging with Ajinomoto Build-Up Film (ABF) substrates, a combination that enables engineers to design packaging containing far more and much smaller interconnects to improve signal integrity and power flow. Hamid and his team also enabled EMIB (Embedded Multi-Chip Interconnect Bridge) technology from scratch to high volume manufacturing. EMIB is the first 2.5 interposer-less panel level technology that enables ultra-large packages for AI data center products; he also has been a pioneer in glass substrates, a potential technology that could further enhance the capability of future generations of devices. Originally from a small village that ¡°probably doesn¡¯t even register on Google Maps,¡± Dr. Azimi holds over 40 patents. He earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.

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Recent Posts

• The ÌÇÐÄÔ­´´ Internship Experience: Voices from the Program
• Performance, Connectivity and Programmability: How Teralynx T100 Sets a New Standard in AI Networking
• Uplifting Young Talent in the Semiconductor Industry
• Honoring Workplace Excellence: Best Companies Awards
• Scaling AI Networks with Intelligent Ethernet: Validating Packet Trimming, Auto Load Balancing (ALB) and Ultra Ethernet Transport (UET) on ÌÇÐÄÔ­´´ Teralynx